Semiconductor manufacturing process technologySMIC N+3 Teardown: How DUV Multi-Patterning Outpitched Intel 18ASemiAnalysis reverse-engineered the Kirin 9030 and found a 32.5 nm minimum metal pitch. Here is what that number teaches you about process technology.SMIC N+3Semiconductor ManufacturingDUV LithographyIntel 18AOhm My God·Jun 16, 2026·6 min readLire l'article