Electronic design automationCadence AuraStack says AI-native EDA can halve PCB and multi-chip packaging design timeThe new Super Agent coordinates board, package, and multiphysics work, which is exactly where tidy chip plans meet physics with a crowbar.Cadence AuraStackAllegro AI StudioPCB DesignAdvanced PackagingTheo·Jul 21, 2026·5 min readRead the story
02Electronic design automationCadence AuraStack makes AI hardware a PCB and multi-chip packaging problemCadence AuraStackCadence Design SystemsPCB DesignAdvanced PackagingTheo·Jul 17, 2026·5 min readRead the story